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Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq
Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Technical Library | 2023-11-20 18:49:11.0
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide.
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Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
endoscopic technology and X-ray imaging adds a greater d
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Assessment: 18% Void, Outer Row, 264 Cycles, BGA256 Figure 23. Macro (Top) and Magnified (Bottom) Views BGA Void Assessment: No Void, Outer Row, 311 Cycles, BGA256 Figure 24 illustrates a solder joint failure due to a 27.1% void that reduced the crack path
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_glenbrook_rtx113_xray.html
Glenbrook Xray Glenbrook Xray Equipment Description Glenbrook Model Number: RTX-113 Serial Number: B1402-1630M Joystick Control BGA and Other Device Inspection X / Y Movement Complete with PC, Monitor, Keyboard, Mouse Portable on Wheels Location: Boston, MA Price
