Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Global solutions for Electronics Manufacturing Services. 5 facilities featuring 17 Fuji & 16 Quad SMT lines, BGA & Micro BGA (Rework/2D X-ray), PTH, Flip Chip, COB, Prototype, ATE (Incircuit & Functional), Box Build, Fulfillment, DFM/DFT and Design.
Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
Electronics Forum | Sun Aug 29 11:33:38 EDT 1999 | Malcolm Montanjees
| | fuji gp, cp642e, ip3 and other | | Dear Sir, please explain what you mean by GP, are you referring to Fujiu GSP printers? if so, what models are you looking for. We have GSP3-5000 and GSP3-4000 avaiable for immedate sale at $25,000 each. FOB Nor
Electronics Forum | Sun Aug 29 18:08:29 EDT 1999 | M Cox
| | | fuji gp, cp642e, ip3 and other | | | | Dear Sir, please explain what you mean by GP, are you referring to Fujiu GSP printers? if so, what models are you looking for. We have GSP3-5000 and GSP3-4000 avaiable for immedate sale at $25,000 each. F
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | SMT Equipment
Fuji CP743 SMT machine. jenny@ksunsmt.com
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Parts & Supplies | SMT Equipment
QP242 INDEX Nozzle fuji nozzle ABHPN-8510 QP-2 INDEX NOZZLE 0.7φ/12 ABHPN-8520 QP-2 INDEX NOZZLE 1.0φ/12 ABHPN-8530 QP-2 INDEX NOZZLE 1.3/12 ABHPN-8670 QP-2 INDEX NOZZLE 1.3/38 ABHPN-8540 QP-2 INDEX NOZZLE 1.8φ/12 ABHPN-8550 QP-2 INDEX NOZZL
Parts & Supplies | Pick and Place/Feeders
QP242 INDEX Nozzle fuji nozzle ABHPN-8510 QP-2 INDEX NOZZLE 0.7φ/12 ABHPN-8520 QP-2 INDEX NOZZLE 1.0φ/12 ABHPN-8530 QP-2 INDEX NOZZLE 1.3/12 ABHPN-8670 QP-2 INDEX NOZZLE 1.3/38 ABHPN-8540 QP-2 INDEX NOZZLE 1.8φ/12 ABHPN-8550 QP-2 INDEX NOZZLE
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
FUJI SMT Pick and Place Machine NXT III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine,
FUJI Pick and Place Robot M3 III Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | Sugar Land, Texas USA | Production
Experience programming/running pick and place machines. Familiarity with Siemens,Fuji, Panasonic, OR MyData. Knowledge of SMT Components and SMT processes a MUST. Also the ability to hand solder a plus.
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support
11 years experience in SMT process.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
BGA Rework Training and Certification – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
