New Equipment | Rework & Repair Equipment
Semi automatic bga rework station machine to desolder and solder chip on mobile pcb Features: 1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved
LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2013-09-13 17:01:33.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E960871700
2080 镭射8005674,40003264 _11.jpg)
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 L
Technical Library | 2015-04-23 18:48:18.0
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ News • Forums • SMT Equipment • Company Directory
| https://www.wesource.com/screen-printers/ok-industries-ssp-85a-stencil/screen-printer-id-140202/
OK Industries SSP-85A Stencil/Screen Printer_ID 140202: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
Lewis & Clark | https://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
OK International/ Metcal APR-5000 Array Package Rework Station - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
