New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems 8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems Introductions: The mainly component is adopted international bran
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Mon Jan 10 11:08:39 EST 2005 | mrgman9999
We are having a problem with popcorning of a plastic BGA that has been under careful humidity control. We have had problems in the past and some have been related to too much trapped internal solvents from the die attach epoxy. We did a life time b
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Career Center | NEW DELHI, India | Technical Support
I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/questions-answers_forum34&SO=R&OB=asc_page9.html
:25pm Problem with Accuracy in Allegro By lalexman , 26 Jun 2015 at 4:29pm 1 178 By chrisa_pcb 27 Jun 2015 at 2:05am Pad size controll By tccab , 06 Jul 2015 at 11
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. In between the solidus and liquidus, a region called the plastic range, some portion of the alloy is solid but the majority is liquid
