Industry News | 2011-01-27 15:53:22.0
Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.
New Equipment | Rework & Repair Equipment
1.Product parameter Total Power 2500W Top heater 1200W Bottom heater 1200W Power AC110~240V±10％ 50/60Hz Operation mode
1.Product parameter Total Power 2500W Top heater 1200W Bottom heater 1200W Power AC110~240V±10％ 50/60Hz Operation mode
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Technical Library | 2012-06-21 23:06:06.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion
Parts & Supplies | Pick and Place/Feeders
Universal Instuments 4796L / Samyo TCM 3700 Feeders Feeders are backwards compatible. (100) CT-0890 8X2 Paper Yellow (20) CT-0896 8X2 Paper Yellow (20) CT-0895 8X2 Paper (0201) Yellow / Black (30) CT-0891 8X4 Paper Red (26) CT-0898 8X4 Paper Re
Parts & Supplies | Pick and Place/Feeders
Universal Instuments 4796L / Samyo TCM 3700 Feeders Feeders are backwards compatible. (100) CT-0890 8X2 Paper (20) CT-0896 8X2 Paper Yellow (20) CT-0895 8X2 Paper (0201) Yellow / Black (30) CT-0891 8X4 Paper Red (26) CT-0898 8X4 Paper Red (100
Parts & Supplies | Pick and Place/Feeders
Universal Instuments 4796L / Samyo TCM 3700 Feeders Feeders are backwards compatible. (100) CT-0890 8X2 Paper (20) CT-0896 8X2 Paper Yellow (20) CT-0895 8X2 Paper (0201) Yellow / Black (30) CT-0891 8X4 Paper Red (26) CT-0898 8X4 Paper Red (100
