Full Site - : bga backward compatibility (Page 6 of 73)

Automatic BGA rework machine Iphone Huawei mobile phone laptop motherboard repair station

Automatic BGA rework machine Iphone Huawei mobile phone laptop motherboard repair station

New Equipment | Rework & Repair Equipment

Specification: Total Power 5200W Top heater 1200W Bottom heater 2nd 1200W, 3rd IR heater 2700W Power AC220V±10%     50Hz Fee

Shenzhen Dinghua Technology Development Co., Ltd.

Anritsu MT8820C

Anritsu MT8820C

Used SMT Equipment | In-Circuit Testers

The MT8820C is an all-in-one Radio Communication Analyzer that is the ideal solution to test LTE, 3G and 2G wireless devices. The MT8820C supports all test functions including signaling, TX parametric, and RX parametric tests. Leveraging the strength

Test Equipment Connection

LeCroy SBAE-20

LeCroy SBAE-20

Used SMT Equipment | General Purpose Test & Measurement

Catalyst SBAE20 Standalone Bus Analyzer/Exerciser Unit The SBAE20 is a standalone bus Analyzer/Exerciser unit for use with USB 2.0 systems. It is designed for the complex testing and verification required for USB hardware and software system valida

Test Equipment Connection

Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

Used SMT Equipment | General Purpose Test & Measurement

Key Features & Specifications Digital Communications Analyzer modes: Oscilloscope with bandwidth in excess of 50 GHz, ensuring the most accurate waveform measurements Eye diagram analyser for transmitter compliance testing Time domain reflect

Shenzhen Zhongce Photoelectric Technology Co., LTD

Agilent 86100C Infiniium DCA-J Wideband Oscilloscope Mainframe

Agilent 86100C Infiniium DCA-J Wideband Oscilloscope Mainframe

Used SMT Equipment | General Purpose Test & Measurement

40 Gb/s Jitter and interference analyzer, measuring subcomponent jitter Time domain reflectometry/transmission (TDR/TDT) for high precision impedance analysis including S-parameters Key features User configurable: mainframe with slots for two

Shenzhen Zhongce Photoelectric Technology Co., LTD

Agilent Technologies Presents Web Seminar Advanced Validation and Testing of

Industry News | 2008-05-03 17:15:32.0

PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a new level. Doubling the speed of the link to 5 GT/s, while maintaining backwards compatibility with PCI Express 1.0 potentially opens up interoperability issues. This presentation describes the methods and tools required to validate PCI Express 2.0 designs.

Agilent Technologies, Inc.

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

ScanINSPECT BGA Inspection System

ScanINSPECT BGA Inspection System

New Equipment | Inspection

ScanINSPECT BGA provides a fast, simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, yet slow, measurement systems. ScanINSPECT BGA uses an intuitive process flow interface integrated with a

ScanCAD International, Inc.

Agilent Agilent E8257D-520-1E1

Agilent Agilent E8257D-520-1E1

Used SMT Equipment | In-Circuit Testers

+30 dBm (typ) with Option 521.     Industry’s best SSB phase noise with Option UNY: -143 dBc/Hz (typ) for a 1 GHz signal at 10 kHz offset Modulation     AM, FM, øM, pulse, and scan     Typical 6 ns rise/fall times and 20 ns pulse width     Dua

Test Equipment Connection

Agilent Agilent E8257D-520-1E1

Agilent Agilent E8257D-520-1E1

Used SMT Equipment | In-Circuit Testers

+30 dBm (typ) with Option 521.     Industry’s best SSB phase noise with Option UNY: -143 dBc/Hz (typ) for a 1 GHz signal at 10 kHz offset Modulation     AM, FM, øM, pulse, and scan     Typical 6 ns rise/fall times and 20 ns pulse width     Dua

Test Equipment Connection


bga backward compatibility searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction Automotive Electronics Supplier - Closure of Tier-One SMT Dvision: (10) ASM & Universal SMT Lines & Feeders Equipment as-new-as 2019! Dek | Koh Young | Speedline | Vitronics | Viscom

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Sell Your Used SMT & Test Equipment

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
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Software for SMT placement & AOI - Free Download.
Thermal Interface Material Dispensing

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.