New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Used SMT Equipment | Pick and Place/Feeders
Features: High-speed placement capability of 25,000CPH (equivalent to 0.14sec/CHIP: best condition) All time, placement absolute accuracy ±50μm (CHIP), ±30μm (QFP) Compatible with a wide range of components from 0402 CHIP～□45
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Used SMT Equipment | Chipshooters / Chip Mounters
BM231 NM-MF13 Panasonic placement machine BM231 parameter: Speed: 0.25S, Loading racks: 60 (double-tape racks 120) pallet 80 stations Component type: 0603-55mm Power supply: 3P/200V/8, Dimensions: 1950/2060/1500mm Weight: 2000kg Suitable c
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Used SMT Equipment | Pick and Place/Feeders
Reliability Powerful Camera algorithm is used Improved recognition accuracy by image noise cancellation of components and automatic teaching function Real-time automatic compensation of Chip, TR, BGA, QFP and other component pick-up positions Easy
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