Electronics Forum | Sat Oct 29 20:29:30 EDT 2016 | adamjs
Posting here because all the threads asking for feedback on it are locked. We have been extremely happy with the 4300 tacky flux for BGA attachment. Not only is it both washable and no-clean (i.e. wash-optional), it was also the only tacky flux tha
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Apr 21 20:08:37 EDT 2004 | Dreamsniper
Now the ball starts rolling. I'm lookin' for a new aqeous cleaner. Do I really need chemical cleaners or saponifiers, surfactant etc. for an Aqeous Cleaning Machine in removing OA or Water Soluble flux from under my 1.27mm Pitch BGA down to 1mm Pitch
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Wed May 20 20:16:29 EDT 1998 | D. Lange
| We notice that DI water seems to tarnish or discolor the metal packaging on crystals and DIN connectors. Our marketing types like the shiney metal surfaces. We don't want to hand solder these parts after washing. | Any suggestions? | Dave F Dave,
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
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