Electronics Forum | Tue Apr 13 09:40:27 EDT 2004 | arcandspark
I do agree with Mike, if you are looking to purchase a board wash system, do not get a dish washer unit, purchase a system built to wash PCB's not dishes. We had them at the former company I worked at and they worked best. They moved everything to Ch
Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york
Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible
Electronics Forum | Thu Jan 13 20:20:45 EST 2011 | hegemon
Not sure this would be of some help, but in the past I worked in the OEM industry in a fully No Clean process using A*M NC Solder. If customer expectations cannot be tempered, you're stuck cleaning the No Clean. To remove the NC residue, (which we
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Wed May 09 03:13:06 EDT 2012 | umar
I had send my coating board to the test lab for adhesion coating test. 3 times send, the result 3times fail. The coating chemical use is Humiseal 1B31. The process is clean the boards at washing process use the Vigon A200 saponifier mix with DI wate
Electronics Forum | Tue Aug 25 21:01:45 EDT 1998 | Peter
We use an Intermec 3240 Thermal transfer printer and print on polyimid label material that survives the reflow and wave solder (top side only) process without turning black. Labels run around 3-4 cents per depending on the size (We found Imtec label
Electronics Forum | Tue Oct 05 14:38:06 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
