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Samsung SM320 Chip Mounter

Samsung SM320 Chip Mounter

Used SMT Equipment | Pick and Place/Feeders

Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed :18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co

Qinyi Electronics Co.,Ltd

Precision PCB Services, Inc. adds Side View Camera to their BGA Rework Stations

Industry News | 2018-07-16 17:50:00.0

Side View Camera now available with all BGA Rework Stations

Precision PCB Services, Inc

Juki Chip mounter KE2070

Juki Chip mounter KE2070

Used SMT Equipment | Chipshooters / Chip Mounters

=1) Vision recognition  ±0.04mm Feeder inputs  Max. 80 on 8mm T/F*6 *1     Please ask for details on E size board. *2     When using MNVC. (option) *3     When using both high-resolution camera and MNVC. (option) *4     Effective

I.C.T ( Dongguan ICT Technology Co., Ltd. )

BGA Placement on Rework Station

Technical Library | 2019-06-12 10:33:58.0

The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.

ACI Technologies, Inc.

Fuji  SENSOR

Fuji SENSOR

Parts & Supplies | Chipshooters / Chip Mounters

FUJI SENSOR AA30L00 H1046A VALVE,STOP H3030A FILTERREGULATOR S4016R SEPARATOR,MIST S3157T SW,PRESSURE WPL5012 CYLINDER H1077T VALVE,SOL S1058A SILENCER H10246 REGULATOR H1067C VALVE,SOL S2085H CYLINDER,AIR S1056A SILENCER H1083T VALVE,SO

Qinyi Electronics Co.,Ltd

Fuji Air Cylinder for Cam Box with

Fuji Air Cylinder for Cam Box with

Parts & Supplies | Chipshooters / Chip Mounters

Air Cylinder for Cam Box with valve PN WPA5142 more others items : pls contact with me freely. Jasmine@QY-SMT.COM uji SENSOR FUJI SENSOR AA30L00 H1046A VALVE,STOP H3030A FILTERREGULATOR S4016R SEPARATOR,MIST S3157T SW,PRESSURE WPL5012 CYLINDER

Qinyi Electronics Co.,Ltd

5-Day Hand Soldering, Rework & Repair Certification Training

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing

Technical Library | 2019-05-30 10:59:13.0

In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.

ACI Technologies, Inc.

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Ball Grid Array (BGA) Voiding Affecting Functionality

Technical Library | 2020-11-09 16:59:53.0

A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.

ACI Technologies, Inc.


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