Industry News | 2013-02-05 14:13:33.0
BGA Rework System Demo Tour
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Parts & Supplies | SMT Equipment
We also supply following Panasonic spare parts : N510008398AA POST KXFB02F0A01 GUIDE KXFB02F1A00 SHAFT KXF0AJYAA00 WASHER KXF0DLTAA00 SPRING KXF0DLUAA00 WASHER KXF0DREAA00 BOLT KXF04Z5AA00 EYE-BOLT KXF0DY18A00 NUT N210022437AA PLATE KXF
Industry News | 2020-03-19 11:12:48.0
Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
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Parts & Supplies | Pick and Place/Feeders
JUKI KE-1070 KE-1080 KE-3010 KE-3020 16AXIS 2CH SERVO CONTROLLER 40044540 Other juki parts: 40044531 MAGNETIC SCALE X SENSOR UNIT 40044532 MAGNETIC SCALE Y SENOR UNIT 40044533 SERVO MOTOR 10W HC-BH0336LW4-S4 40044534 SERVO MOTOR 30W 40044535 4A
Industry News | 2003-09-26 14:11:18.0
Mark Capizzi
