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BGA Bumps

Industry Directory | Manufacturer

Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale

DH-A2 automatic BGA rework station for computer and mobile phone repairing

DH-A2 automatic BGA rework station for computer and mobile phone repairing

Videos

Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si

Shenzhen Dinghua Technology Development Co., Ltd.

SMT Solutions

Industry Directory |

Salvage of BGA (Re-balling), Tape and Reel Services , PCB Repair

BGA (Ball Grid Array) Packages

BGA (Ball Grid Array) Packages

New Equipment | Other

PBGA,CABGA,CTBGA,FBGA,Metal BGA,uBGA,Super BGA,Stack BGA

Standard Systems

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Multi-Fuction Placer With LCS Available! 4 Standard Change Heads & 4 FNC Heads Component Range:  0201 to 32mm Square   Placement Rate:18,000CPH (Chips), 2,500 (QPP)    Maximum Board Size:  460mm x 440mm (18.1" x 17.3")  

Thinking Productivity Inc

Servetronics Manufacturing Limited

Industry Directory | Manufacturer

• Circuit Design • PCB layout • Rapid Prototyping • Bare board manufacturing • PCB assembling & Testing • SMT ( Surface Mount Technology ) • Through Hole Technology • BGA ( Ball Grid Array ) •

BGA rework and re-balling Services (BGA REPAIR)

BGA rework and re-balling Services (BGA REPAIR)

New Equipment | Rework & Repair Services

Complete BGA rework service. Remove - reball - replace - xray.

NAT

Zevatech FM 760

Zevatech FM 760

Used SMT Equipment | Pick and Place/Feeders

ZEVATECH FM 760 Pick and Place Machine with tray and feeder With TD-3D Tray Loader # TRO-3D212 Maximum Board Size 18in x 20in Front Feeder Trolley Cart and Rear Fixed Feeder Bank LA and LAIC Heads OCC Cameras, Bad Mark Sensor Shape Clamp IC

SmartAVI Inc

BGA IC Reconditioning

New Equipment |  

Recondition and Re-ball BGA IC's

BGA Bumps


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