Industry Directory | Distributor / Manufacturer
Distribute solder supplies, bga inspection, bga re-balling, repair/rework equipment. Outfit assembly personel to perform all phases of manufacturing
Industry Directory | Manufacturer
New Age Technologies is a Electronic Manufacturing Services Provider in Business Since 1988
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
Industry Directory | Consultant / Service Provider / Manufacturer
PCB & Cable Assemblers TMS was established over 25 years ago in Wokingham , Berkshire, as a cable assembly company trading under the name Robinson's Computer Technical Services. In 1993 the trading name was changed to Robinson's D
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v
Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile
Industry News | 2010-05-29 18:01:49.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.
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