Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
European supplier of Lead Free solder products like the paste compositions SnZnAl (low melting point), SAC, SnBi, flux, BGA Balls, solder wire, N2 Reflow Systems.
Industry Directory | Manufacturer
Scotle Founded in 2006,a manufacturer for Scotle BGA rework stations, and other SMD rework accessories. Scotle accept OEM and ODM worldwide. Top quality, best service is always the persuit of Scotle.
Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work
Industry Directory | Manufacturer
pcb construction@testing using surface mount and through hole components.
Laser cut stencils c/w Electro-Polished (mirrored finish) Multi Step Stencils Rework mini stencils Surface Mount Transport Plates Metal Squeegee Blades and Blade Assemblies Ball Grid Array (BGA) Re-Ball Fixtures Photo Plotting Electro - Polishing Fra
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Industry Directory | Distributor / Manufacturer
Distribute solder supplies, bga inspection, bga re-balling, repair/rework equipment. Outfit assembly personel to perform all phases of manufacturing
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly
