Industry News | 2012-01-24 16:12:56.0
VJ Electronix will display a fully configured SRT Micra Rework Platform in Booth #3051 at the upcoming IPC APEX Expo.
Industry News | 2013-01-15 11:02:53.0
VJ Electronix, Inc. will display its new Vertex II next-generation X-ray technology and fully configured SRT Micra Rework Platform in Booth #333 at the upcoming IPC APEX Expo
Industry News | 2017-02-10 21:25:25.0
Carlsbad, CA – February 10, 2017. Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating AOI solutions for SMT and Microelectronics, 3D AOI and advanced software products at IPC APEX EXPO 2017 at the San Diego Convention Center from February 14 to 16. MVP is exhibiting at Booth #2509.
Industry News | 2013-04-03 18:52:22.0
SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK
Industry News | 2019-01-04 16:38:36.0
Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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