Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Thu Jan 16 04:02:18 EST 2003 | johnw
The IPC 610 actally conflict's with 7095 which give's a better indication of what's acceptable. I believe that IPC are reviewing both. Motorola did a bunch of work before basically showing that void's aren't that bad up to a certain size, I think pro
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Fri Mar 27 05:11:24 EDT 2015 | robertwillis
If you want a step by step guide on BGA look at my NPL/IPC "Defect of the Month" video clips https://www.youtube.com/watch?v=MC4K0eSXH18 For other process issues there are also videos which may assist on other process issues like voids, solder ball
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus
Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
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