Electronics Forum | Fri Oct 16 07:33:01 EDT 1998 | smd
| | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | Q: Can you get away w
Electronics Forum | Wed Feb 25 09:22:53 EST 1998 | Earl Moon
PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'
Electronics Forum | Wed Feb 25 09:21:05 EST 1998 | Earl Moon
PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'
Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach
| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:
Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Fri Jan 15 17:13:07 EST 1999 | Earl Moon
| | | | Hello, | | | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | | | So far, the tests I can think of
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
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