Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
Electronics Forum | Thu Dec 07 12:18:28 EST 2006 | realchunks
It may be for a double sided reflow process. Yes, some people do put the BGA on first. I know this first hand.
Electronics Forum | Wed Dec 06 21:59:37 EST 2006 | SMTrework
Hello, we rework BGA packages that come back from the field. I've seen on occasion a black and or red "epoxy" substance from the manufacturer on the corner of some board's BGA chips that I imagine are applied to increase corner bond of the chip to th
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
