Electronics Forum | Thu Feb 19 19:34:52 EST 2004 | Tom B.
Jim, There are 2 thoughts to this technology. SMDP (Soldermask Defined Pads) Can achieve more uniform opening of the land, yet as you know Regisration shift of mask can become a problem. Also there has been debate as to whther SMDP cause crack p
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Wed Jan 17 20:08:23 EST 2001 | John Dwinell
Hello All, I am looking for any insight RE: reworking the Xilinx 4044XL 40x40 BGA chip. A customer of mine has no trouble removing it, however, when installing with their BGA rework station, the corner solderballs consistently collapse. Has anyone
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Thu Jan 05 11:23:49 EST 2006 | samir
Grant I'm gonna have to go ahead and sort of disagree with you there. The studies that I've been reading from various BGA Manufacturers have identified insufficient homogenizing / coalescing of the Sn/Pb Paste with the SnAgCu balls. Ball not touchi
Electronics Forum | Mon Jul 24 13:45:14 EDT 2006 | samir
Most Test Technicians, Managers, and everyone else in the organization always believe that the BGA is the #1, and most likely failure mode in a circuit. You can analyze it with all the tools available...2D, 3D, 10D, underneath, etc...... convince th
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
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