Electronics Forum | Thu Jul 15 10:33:59 EDT 1999 | Michael Zadrejko
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Sun Mar 12 01:58:44 EST 2006 | grantp
Hi, We have been soldering lead free BGA's onto products with lead based paste, and we have had no increase in defects at all. We have used a standard lead paste profile, so we are not altering the temps anything from what's recommended by the paste
Electronics Forum | Thu Jan 05 15:09:37 EST 2006 | grantp
Hi, What studies? Can you post a link? I am not sure what the difference is between a ceramic BGA that the high temp solder ball is not expected to collapse, and a lead free solder ball that's run through a lead process and also does not collapse b
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Wed Jan 26 14:04:03 EST 2000 | Joe Zarketa
Casey, I agree the Sniper is a fine machine! I'm doing uBGA's with a Sniper system and it is working great. Great uniform chip collapse! Plenty of power....That's why we bought the machine....Also, very easy for the production people to use. Jo
Electronics Forum | Thu Aug 21 20:43:21 EDT 2003 | davef
We just plant BGA in the paste when we place them with a standard flex machine. You know, just set your placement force to get the balls into the paste. Justin is correct about collapse.
Electronics Forum | Wed Apr 19 08:19:41 EDT 2006 | davef
So, your solder ball didn't collapse. What is the ball material? More and more BGA are shipped leadfree. For image posting, look here: http://www.free-webhosts.com/free-image-hosting.php
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
