Electronics Forum | Fri Aug 25 10:29:13 EDT 2006 | Chunks
With tacky flux, the BGA is not as reliable as one that was never repaired. I believe Dave stated that the higher offset may have something to do with it. Also with tacky flux, the ball collapse form side to side varies a bit. Sometimes a ball(s)
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Sat Jun 30 09:35:59 EDT 2001 | dmr
I have tried just about everything avalible for BGA inspection on the market. We use X-ray which is great, even through we have a 5-d machine, I use my 2-d unit most often. We also have the expensive scope that lets you look completely through under
Electronics Forum | Thu Aug 17 05:56:39 EDT 2000 | Jacqueline
Hi Folks, Hope yous can help. I'm having a problem when reworking (placing) 40mil BGAs. One side seems to be collapsing more so that the other, resulting in the outer row of balls not properly reflowing and making the connection. This is only happeni
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Wed Jun 23 13:03:01 EDT 2004 | russ
I would ditto CAL, we have a jewel box 90 with the 5 axis and we love it. I really like being able to tilt,rotate,and move side to side front to back, Angle viewing under a BGA can be very informative as to the quality of reflow in seeing ball coll
Electronics Forum | Wed Apr 27 10:47:26 EDT 2005 | HOSS
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff. Depending on the application of this product and required reliability, you may want to stay with the padstack being used. You may try c
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Wed Apr 09 11:23:02 EDT 2003 | davef
Nice pix. The pebbly texture that you're seeing is aptly called "orange peel". Temperature appears to significantly influence the appearance of solder spheres during soldering. Indeed, when the reflow temperature is high, tin continues smelting long
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