Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Mon Jul 19 09:53:07 EDT 2004 | Mighty C
Good Morning Rush Fan, We have a Metcal VPI 1000. We are very happy with the system. The price is competitive, software is easy to use and the picture quality is good. They have a great lighting scheme that illuminates under a BGA extremely well. Th
Electronics Forum | Sat Jan 14 06:38:04 EST 2006 | DannyJ
Hi Ken, Good question, and I did search for what you are asking, but unable to find anything conclusive about using tacky flux vs. solder. In reliability, it depends on which section of the process you are talking about. Mainly (and there are sev
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Tue Apr 27 05:10:34 EDT 1999 | Earl Moon
| Which is the preferred method for soldering a bga, adding solder paste or not? Solderpaste manufacturers say to add solder while the rework station manufacturer's say it's not necessary. | Paste is preferred by not necessary. Our studies, conduct
Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Wed Oct 20 16:05:47 EDT 1999 | Mark Charlton
I knew this would happen. Someone wants to rework a bad BGA artwork by cutting a trace and adding a wire under a 292p 1.27mm pitch PBGA. Has anyone done this before? What kind AND size wire do you use? How do you hold it in place during the replc
Electronics Forum | Mon Jan 13 06:28:15 EST 2003 | johnw
Hi folk's, I'm looking for some help full suggestions here... I've got a ceramic BGA with tn/lead / bismuth balls on it that is over collapsing due to the weight of the momponnet vs the ablity of theball to suppot them. We've spok eto the component
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Mon Nov 25 18:43:29 EST 2013 | hegemon
Without the proper tools in house you will not be able to determine anything but the most obvious problems. At minimum, some side looking microscope that would allow visual inspection of a row or two, and to be able to rule out bridging. Using that
