Yamaha M20 Hybrid Modular Surface Mounter factory Speed:30,000 CPH Applicable PCB: L1,480 x W510mm Weight:1450KG Dimension:L1750xD1750xH1420mm Product description: Yamaha M20 Hybrid Modular Surface Mounter factory Yamaha M20 Hybrid Modular S
Revolutionary and unique new features included as standard New Multi-Conveyor System providing the highest large board handling capability 3D hybrid placement functions Wide ranging component handling capability and high feeder capacity Ultimate flex
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
http://www.flason-smt.com/product/Yamaha-YG100-Pick-and-Place-Machine.html Yamaha YG100 Pick and Place Machine Yamaha YG100 Pick and place machine 1,650(L)x1,562(W)x1,850(H)mm Patch speed: 24,000 CPH Weight: 1,630kg Product description: Yamah
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Parts & Supplies | Pick and Place/Feeders
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Used SMT Equipment | Pick and Place/Feeders
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Industry Directory | Manufacturer
VJ Technologies, Inc. offers leading-edge solutions for the most advanced X-ray imaging applications.