Full Site - : bga corner bonding (Page 16 of 58)

PEMTRON to Exhibit a Benchmark in AOI & SPI Technology at SMTA Chihuahua Expo

Industry News | 2024-07-01 11:29:20.0

PEMTRON is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum. The event is scheduled to take place Thursday, Aug. 15, 2024 at the Hotel Sheraton Soberano Barranca Del Cobre in Chihuahua, Mexico. PEMTRON will be focusing on its revolutionary D2 (Dual Lane & Dual Head) Series.

Pemtron

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014

Industry News | 2014-08-28 15:48:58.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.

Nordson DAGE

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Industry News | 2012-09-10 09:15:27.0

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

Finetech

Al Cabral Joins Finetech as Regional Sales Manager

Industry News | 2013-05-28 14:45:16.0

Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.

Finetech

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

Metcal Develops New Hand-Piece to Meet Higher Thermal Demands

Industry News | 2015-01-05 19:59:08.0

Metcal is pleased to introduce the new MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five new SMTC dual-shaft cartridge geometries also are available in two temperature series.

Metcal

ASC International Highlights Unicomp Technologies’ X-ray at SMTA Upper Midwest Expo

Industry News | 2016-06-28 15:44:10.0

ASC International today announced that it is collaborating with Unicomp Technologies to highlight X-ray equipment at the SMTA Upper Midwest Expo, scheduled to take place Thursday, June 30, 2016 at the Minneapolis Marriot Southwest Hotel in Minnetonka, MN.

ASC International

Unicomp Technologies/ASC International to Demo X-ray at New England SMTA Expo

Industry News | 2016-11-01 19:22:40.0

ASC International today announced that it will be collaborating with Unicomp Technologies to highlight X-ray equipment at the SMTA New England Expo, scheduled to take place Thursday, Nov. 3, 2016 at the DCU Center in Worcester, MA.

ASC International


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