Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
New Equipment | Rework & Repair Equipment
Seamark top selling optical motherboard BGA chip rework station ZM-R6200 for laptop/mobile PCBA chip soldering and desoldering More information(Rita Li):Whatsapp/Wechat/Viber:0086 134 3448 1030 Skype:Rita Li
New Equipment | Rework & Repair Equipment
We provide X-ray inspection and BGA rework solution since year 2005 For more information, contact me by : whatsapp/Wechat:0086 134 3448 1030 Email:sales11@zhuomao.com.cn skype:ritaleeli High precision hot air soldering machine for LED strip li
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
New Equipment | Rework & Repair Equipment
Application This machine is used for repairing the broken BGA (Ball Grid Array package) chipset on the PCB motherboard. 1. Laptop & desktop PCBA 2.Game console,such as Xbox one,Play Station 4 3.Mobile phone PCBA 4.TV&TV Set-top box motherboard 5.Se
We provide Bga rework station and X-ray inspection machine for SMT. For more information , please contact Rita Li by: whatsapp:0086 134 3448 1030 Skype:ritaleeli Seamark Zhuomao Fine pitch LED repairing equipment ZM-R720 for beads soldering and
New Equipment | Rework & Repair Equipment
X-ray inspection equipment , X ray component counter and BGA rework station, Contact Rita Li for more information by : whatsapp:0086 134 3448 1030 Skype:ritaleeli Email:sales11@zhuomao.com.cn Application This machine is used for repairing the
