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Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
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On site and online Training and consultancy in electronics manufacture. Wide range of training products which are solder worldwide by IPC, SMTA, SMART Group and others
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2014-10-30 19:03:02.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Etek’s Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.”
Industry News | 2015-03-03 13:11:14.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany.
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
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