Factory Perfect Choice Infrared BGA Rework Station ZM-R720 Can Repair Smallest Components 01005 Product Application: Seamark ZM-R720 LED rework station is uitable for LED lamp beads repairing, can also desolder and solder any BGA and components wh
Professional Small Chips IC Welding Machine ZM-R720 BGA Rework Station Product Application: Seamark ZM-R720 LED rework station is uitable for LED lamp beads repairing, can also desolder and solder any BGA and components which are difficult to repai
New Equipment | Assembly Services
NextPCB has specialized in PCB Prototype and PCB Manufacturing for 15 years. In order to offer the best service and competitive price to our customers, we have PCB Prototype manufacturer and PCB Manufacturing Manufacturer dedicated to each PCB fabric
New Equipment | Rework & Repair Equipment
China TOP 1 led module repairing machine ZM-R720 for P1,P1.2,P1.5,P2 LED soldering and desoldering For more information, contact Rita Li by whatsapp/wechat/viber:0086 134 3448 1030 Skype:ritaleeli Application This machine is used for repairi
Industry News | 2003-06-20 18:28:55.0
Makes continuity and placement evaluation a snap.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
