Industry News | 2024-07-15 11:37:32.0
SHENMAO America, Inc. is pleased to announce that its various solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) certification for Recycled Content Standard, which now includes auditing of social responsibility procedures.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
Industry News | 2016-04-06 19:16:38.0
Carlsbad, CA – April 7, 2016: Machine Vision Products, Inc. (MVP) today announced it has launched a brand new website showcasing the dynamic and broad range of it’s AOI products and applications offerings.
Industry News | 2013-07-05 17:24:15.0
SMART Group announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.
Industry News | 2012-04-11 15:15:57.0
Invensas Will Demo xFD Solutions at IDF Beijing and Present at the International Conference on Electronics Packaging in Tokyo
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Industry News | 2011-04-05 21:42:34.0
Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2012-02-03 13:29:38.0
Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.
Industry News | 2017-03-06 05:20:47.0
For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk
