Parts & Supplies | Pick and Place/Feeders
FX-1R hard drive with JUKI system 128 version 40044513 Other juki parts: 40044509 HARD DISK ASM(FX-1 ST) 40044510 HARD DISK ASM (FX-1_JE) 40044511 HARD DISK ASM (FX-1_CH) 40044512 HARD DISK ASM (FX-1_CH) FOR XP 40044513 HARD DISK ASM(FX-1R) 40
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2003-04-10 07:58:34.0
The answers that you need to stay competitive in today's market
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2013-01-28 02:11:23.0
Offers precise, repeatable dispensing of phosphor for coating and encapsulation
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2016-05-09 21:21:15.0
SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Parts & Supplies | Component Packaging
L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F
