Electronics Forum | Wed Oct 20 11:32:23 EDT 2004 | pbatten
Has anyone seen a footprint for these new parts? If so where? Thanks http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf
Electronics Forum | Wed Oct 20 11:32:28 EDT 2004 | pbatten
Has anyone seen a footprint for these new parts? If so where? Thanks pbatten http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf
Electronics Forum | Tue Apr 26 18:23:30 EDT 2005 | russ
How does your machine recognize the part? Does it use vision for ball inspection or a just a body scan? What is the aperture size on the stencil? Have you calculated the area ratio? What is the aperture shape? What type of paste are you using? is
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont
Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Tue Jul 31 20:00:08 EDT 2001 | davef
SUPPLIERS: * Sonix 8700 Morrissette Dr Springfield, VA 22152 (703) 440-0222 ext 155 fax 9512 John Goings * Sonoscan 2149 E Pratt Blvd Elk Grove Village IL 60007 800.950.2638 630.766.7088 fax 4603 http://www.sonoscan.com info @sonoscan.com John Ippen
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
