Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Tue Feb 20 14:35:47 EST 2007 | ehess
FRank, are the BGA's in question a no-lead part? This usually results inthe paste flowing to make the electrical contact and not the ball, so I assume they could possibly crack easier than a leaded part. We have been receiveing almost all our BGA's
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
Electronics Forum | Fri Oct 16 09:46:32 EDT 1998 | Bob barr
I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? Tha
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
