Electronics Forum | Wed Sep 17 18:16:28 EDT 2008 | yam6rider
Adam, Most leadfree components can handle only 260C. When you doing the profile, you should put thermocouple on the of the BGA package and to ensure the temp is not go over 260C.
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Fri May 04 02:17:48 EDT 2007 | clusogreg
Are you sure the BGA is not Leadfree and the proces you are using is a leaded process? If so then the Balls will not reflow and there will be cracking. Likewise the other way around
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Thu Jul 15 12:07:36 EDT 1999 | Mark
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discu
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
Electronics Forum | Wed Sep 23 12:08:21 EDT 2009 | davef
larob57 Mike is not being a SA. The GPU in the XBox is packaged as a BGA [ball grid array].
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
