Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
Electronics Forum | Wed Sep 23 12:08:21 EDT 2009 | davef
larob57 Mike is not being a SA. The GPU in the XBox is packaged as a BGA [ball grid array].
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Tue Mar 04 20:47:48 EST 2008 | davef
Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure 4.14-3, Note 10: A1 corner must be identified by chamfer, ink, mark, metalized markings, indentation or other feature of package body, lid or integra
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Electronics Forum | Mon Oct 05 04:55:42 EDT 2009 | pengliang
we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to do dye analyse (note:pls confrm is there have crack )
Electronics Forum | Wed Feb 02 20:53:34 EST 2000 | Dave F
Dennis: Several points: 1 If you're talking AlphaLevel process (?): � Good solderability, as HASL, even no-cleans bite well. � Planarity, uniform deposit, no bridgin� of FP. � Doesn't store as well as NiAu ... LT 6 months sealed � Very sensitive t
