Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper
Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Thu Aug 02 17:56:27 EDT 2001 | jporter
We are considering having some BGAs packages re-balled. Where can I go to find out more information on this process? Especially, any adverse affects on the long term functionality of components subjected to this process. Thanks.
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
