Non-profit trade association for the health care industry comprised of a broad cross-section of approximately 200 organizations. Medical Alley is known for its high-quality health care education and training programs, government issue leadership, and convening its members to address critical health care issues.
Failure analysis - Components as well as PC boards, Discretes, Passives ICs - offering X-ray. SEM/EDX -XRF - Cross sectioning complete root cause F/A
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW! All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
Electronics Forum | Mon Jun 02 22:28:29 EDT 2014 | acdc
Try the VPI-1000 by Easy Braid. Solid choice with great customer feedback.
Electronics Forum | Fri May 30 07:45:06 EDT 2014 | rrosera
Can anyone recommend a good reasonably priced microscope for looking at cross sections? The ones I'm finding with the magnification we're looking for all seem to be for glass slides.
Used SMT Equipment | X-Ray Inspection
• Installed new in 2006 • Single Owner and used in a Lab Environment • Maintained by OEM and under OEM ASC, throughout original ownership • Currently offline and immediately available Tube Type: 160kv NF – Transmissive type (open tube ~ maintain
Used SMT Equipment | In-Circuit Testers
Fluke 5500A Multi-Product Calibrator The Fluke 5500A Multi-Product Calibrator is a revolutionary product that addresses a wide cross-section of your electrical calibration work load. It sources direct voltage and current, alternating voltage a
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Parts & Supplies | Pick and Place/Feeders
JUKI 2020 board E86177290A0 OPERATION SW BOARD ASM Other parts: E86147250A0 FEEDER UNIT PWB ASM. E86147290A0 XMP RELAY BOARD ASM. E8614729AA0 XMP RELAY BOARD A ASM. E8614729MA0 XMP RELAY BOARD ASM. (M) E8614729NA0 XMP RELAY BOARD ASM E86157150
Parts & Supplies | Pick and Place/Feeders
JUKI KE2010 HEAD MAIN PWB ASM E86137290A0 Other juki parts: E86127250A0 OCC LIGHT CIRCUIT BOARD A ASM. E86127290A0 HEAD RELAY PWB ASM. E8612729AA0 HEAD TOP COVER A ASM. E8612729BA0 HEAD RELAY PWB B ASM E8612729CA0 HEAD RELAY PWB C ASM E8613700
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
A demo of the Shuttle Star SV560 A BGA Rework Station.
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/bga-rework-machine-model-sv550
BGA Rework Machine - Model SV550 – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
