Full Site - : bga failed after underfill (Page 11 of 14)

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 02:14:39 EST 1999 | Joe

| | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of

Solid Solder Deposit

Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe

wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony

| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony

| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T

| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |

Re: Void in solder bump

Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman

| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |

Re: Void in solder bump

Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Re: BGA rework : IR or convection

Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson

| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon

| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef

His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could


bga failed after underfill searches for Companies, Equipment, Machines, Suppliers & Information