Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
Industry News | 2015-03-27 04:46:07.0
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Contract Manufacturer - Services Provided: SMT, PCBA, Plastic Injection Molding, Metal Stamping, Custom Cable & Wire Harness Assembly, Turnkey Manufacturing Services
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
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