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BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Precision PCB Services, Inc. geared to offer training and consulting services Worldwide.

Industry News | 2009-02-03 13:34:04.0

New PCB Rework, Repair, Fabrication Training & Consulting Services.

Precision PCB Services, Inc

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

good news for LED industry

Industry News | 2018-10-18 09:26:46.0

good news for LED industry

Flason Electronic Co.,limited

BGA Solderability Testing 'Bob Willis How to Do It'

BGA Solderability Testing 'Bob Willis How to Do It'

Videos

Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als

ASKbobwillis.com

Head-in-Pillow BGA Defects

Technical Library | 2009-11-05 11:17:32.0

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.

AIM Solder

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: Model: SDC-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. Ex

SMT Dry Cabinets by Eureka Dry Tech

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, ​Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye

SMT Dry Cabinets by Eureka Dry Tech

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bga failure after vibe searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Reflow Soldering 101 Training Course
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