Electronics Forum | Wed Sep 30 08:21:07 EDT 2009 | cunningham
Hi We have a board at the moment thats passing ICT and passing functional test but its failing test after conformal coating has anyone had any experinces of this? or any idea what may be causing this?
Electronics Forum | Mon Oct 05 04:55:42 EDT 2009 | pengliang
we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to do dye analyse (note:pls confrm is there have crack )
Electronics Forum | Thu Oct 08 01:07:46 EDT 2009 | tpappano
I have used 1A33 for many years with excellent results on through-hole pcbs in equipment subjected to very hot and very cold environments. Because 1A33 continues to harden with time, I assumed it would simply not be usable on smt boards, cracking t
Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC
We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Mon Aug 14 08:18:24 EDT 2006 | John N.
Hi all, I work for a service company who do SMT repairs for a Blue Chip. The JEDEC standard doesn't seem to mention how long (if at all) you should bake a planar after placing a new BGA (after field failure). Any ideas? Thanks in advance. regards Joh
