New Equipment | Board Handling - Storage
Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye
Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS
Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS
Electronics Forum | Sat Dec 18 08:23:33 EST 2010 | remullis
I experienced warpage on a 7'x 13" long board, unfortunately my oven does not have center support. I use stiffeners on both of the short ends. It fixed my problem. Some of the things I was experiencing with the warpage on the second pass were placem
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
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SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
and Figure 16 clearly shows the significant difference in the reliability of the U1 components, which were located in one corner of the test board, compared to the other BGA56 components. This indicated that the secondary failure mechanism was due to an
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-tell-if-a-printed-circuit-board-is-bad/
. What Are the Four Most Common Reasons for PCB Failure? Environmental Factors Before fabricating and manufacturing a printed circuit board, it is often critical to assess the environments they are going to be used in
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