Full Site - : bga failure heatsink (Page 13 of 62)

Hands on Master Class Series from Bob Willis

Industry News | 2017-03-06 05:20:47.0

For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk

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Universal Instruments’ APL Holds AREA Consortium Meeting

Industry News | 2012-11-29 13:46:02.0

In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.

Universal Instruments Corporation

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Industry News | 2013-02-08 23:26:44.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

Zymet, Inc

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

Industry News | 2022-05-18 13:07:51.0

SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing

Industry News | 2022-08-14 14:26:09.0

SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

Shenmao Technology Inc.

X8011-II PCB - 3D MXI

X8011-II PCB - 3D MXI

New Equipment | Inspection

Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a

Viscom AG

Soldering Support Online or On Site

Industry News | 2016-07-10 12:08:40.0

All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry

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M606 China High speed LED pick and place machine smt chip mounter with feeder

M606 China High speed LED pick and place machine smt chip mounter with feeder

Videos

We can provide professional SMT one line sulotion include SMT loader, Solder paste printer , reflow oven, AOI and so on. E-mail: tina@gdmoje.com Web: www.moje.en.alibaba.com

Guangdong Moje intelligent Equipment Co,.LTD.

Process Sciences Announces "SMT Bootcamp" Training Course Schedule

Industry News | 2001-02-22 18:03:41.0

Process Sciences (PSI) has announced the schedule for upcoming "SMT Bootcamp" courses. These highly popular, 2 day intensive training courses provide in-depth, practical process understanding to persons interested in ensuring quality in electronic assemblies.

Process Sciences, Inc.

Assel purchases sophisticated X-ray equipment

Industry News | 2009-10-08 05:00:35.0

Assel - All-in-One Contract Manufacturing

Assel


bga failure heatsink searches for Companies, Equipment, Machines, Suppliers & Information

IPC Training & Certification - Blackfox

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