New Equipment | Solder Materials
AIM WS Paste Flux is a water washable tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM WS Paste Flux may be used for general touch up or rework of printed circuit boards, and
New Equipment | Solder Materials
WS735 is an alcohol based, organically activated, water-soluble liquid flux designed specifically for wave solder applications. WS735 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS735 is active at
New Equipment | Solder Materials
WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers
New Equipment | Solder Materials
RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based
New Equipment | Rework & Repair Equipment
The Ersa HR 500 Hybrid Rework System is the first choice for all common rework tasks on medium-sized SMD assemblies. The system is suitable for desoldering, placing and soldering PLCC, QFP and BGA components as well as MLF components o
New Equipment | Solder Materials
WS716 is a halogen- and halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed for
Flux in-line Solder Flux Inspection and Measurement System process control tool for BGA, CSP and flip chip component manufacturing
New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
New Equipment | Cleaning Agents
MAIL IN & FREIGHT IN AVAILABLE - We can assist with logistics Outsourced Services Flux removal PCB Cleaning manually with chemistries In-House Testing & Diagnostics PCB Repair SMT Electronics Reflow / Rework BGA Rework / Replacement BGA
