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IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Industry News | 2018-06-20 20:36:50.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

Association Connecting Electronics Industries (IPC)

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Industry News | 2019-01-12 07:42:28.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2020

Industry News | 2019-02-18 17:18:54.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

Industry News | 2019-09-10 13:25:11.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2021

Industry News | 2020-03-08 16:23:52.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.

Association Connecting Electronics Industries (IPC)

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Industry News | 2022-11-22 06:14:08.0

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.

Dongguan Intercontinental Technology Co., Ltd.

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Juki JUKI 102 nozzle E35027210A0

Juki JUKI 102 nozzle E35027210A0

Parts & Supplies | Chipshooters / Chip Mounters

JUKI 102 nozzle E35027210A0 JUKI E5112715000 BU SPACER (0.8) JUKI E5113715000 BU SPACER (1.0) JUKI E5114715000 BU SPACER (1.2) JUKI E5115706000 LEVER 24 JUKI E51157060A0 LEVER 24 ASM. JUKI E51157060B0 LINK ASM JUKI E5115706AB0 RINK 24 ASM JUKI E511

ZK Electronic Technology Co., Limited

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

X-ray inspection for PCB and BGA

X-ray inspection for PCB and BGA

Videos

BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c

BEST Inc.


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INSPECTION TECH
INSPECTION TECH

Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.

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