Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott
Electronics Forum | Fri Oct 06 08:22:05 EDT 2000 | jackofalltrades
BGA's are not difficult, but should be inspected no matter how careful you are. Here we have been doing bga's forever and x-ray 100%. Without an x-ray there is no good way to ensure the BGA is placed properly, without bridging or insufficients. If yo
Used SMT Equipment | AOI / Automated Optical Inspection
2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2018-11-07 03:31:04.0
Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it
This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production. This YTX-X3 is available at the Capital Equipment Exchange. https://www.ce-exchange.com/details/?product=7426&pn=YESTech-YTX-X3-3D-X-Ray
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Singapore, Singapore | Engineering,Production
I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici
array (BGA) and chip scale package (CSP) manufact
| https://www.eptac.com/soldertip/soldertip-46-open-connections-found-on-bga-components/
SolderTip #46: Open Connections Found on BGA Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
