New Equipment | Rework & Repair Equipment
The PDR E3G Evolution - Next Generation Rework System - is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno
New Equipment | Assembly Services
1.Manual High Precision Solder Printer PM3040 Specification Items NeoDen PM3040 Dimensions 580×320×260(mm) Platform Size 300×400(mm) PCB Size
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Industry Directory | Manufacturer
Contract Manufacturer - Services Provided: SMT, PCBA, Plastic Injection Molding, Metal Stamping, Custom Cable & Wire Harness Assembly, Turnkey Manufacturing Services
Industry Directory | Consultant / Service Provider / Manufacturer
SPIN PCB offers short run and prototype contract manufacturing services, as well as mid-volume manufacturing solutions. Turnkey or consigned material, lead free processing, through hole, surface mount, bga's, whatever our customers need.
Industry Directory | Manufacturer
Precision Assembly Inc. offers the most Innovative Electronics Contract Manufacturing Services and Solutions (ECMSS) to meet the needs of our customers. Our highly skilled teams have the manufacturing expertise required to meet your needs
Industry Directory | Manufacturer
Computrol, Inc. is a national leader in low to medium volume, high mix contract manufacturer of electronic assemblies. We specialize in customer service, quality and on time delivery. We have 3 locations in the United States.
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