Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Industry News | 2022-08-26 09:15:23.0
SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.
Industry News | 2010-06-21 14:29:09.0
MERIDIAN, IDAHO ― Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMS, announces that it handles dynamic engineering changes and quickly ramps up or down to meet changing product and volume demands in order to improve customers’ inventory costs, cycle times and, ultimately, the level of customer satisfaction.
Industry News | 2011-04-27 18:30:13.0
Computrol purchased a Trident LD Automatic Defluxing System from Aqueous Technologies, Corp. during the recent IPC APEX EXPO in Las Vegas.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2008-05-23 18:09:23.0
LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2003-04-08 18:29:26.0
New for 2003
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
