Full Site - : bga mechanical (Page 1 of 81)

MIRTEC Corp. Wins a 2008 NPI Award for its MV-7L In-Line AOI System

Industry News | 2008-04-07 22:15:22.0

OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

MIRTEC Corp

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

Yamaha YV100 Ⅱ YAMAHAmulti-functional chip mounter

Yamaha YV100 Ⅱ YAMAHAmulti-functional chip mounter

Used SMT Equipment | Pick and Place/Feeders

Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100 Ⅱ YAMAHAmulti-functional

Yamaha YV100 Ⅱ YAMAHAmulti-functional

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100 Ⅱ YAMAHAmulti-functional chip mounter Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 100

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100ll pick and place machine

Yamaha YV100ll pick and place machine

Used SMT Equipment | Pick and Place/Feeders

Yamaha YV100ll pick and place machine Product name: YV100 Ⅱ YAMAHAmulti-functional chip mounter Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manua

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100 Ⅱ multi-functional SMT machine

Yamaha YV100 Ⅱ multi-functional SMT machine

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha original YV100 Ⅱ YAMAHA multi-functional SMT machine

Yamaha original YV100 Ⅱ YAMAHA multi-functional SMT machine

Used SMT Equipment | SMT Equipment

Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

SMT mounter Feeder common types and classification from KINGSUN

Industry News | 2023-08-17 14:26:37.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Pad Cratering

Technical Library | 2020-05-08 18:22:31.0

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.

ACI Technologies, Inc.

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)


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Thermal Transfer Materials.