Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
Industry Directory | Consultant / Service Provider / Manufacturer
Full Service Electro Mechanical and Electronic Contract Assembly Services Provider
Industry Directory | Consultant / Service Provider / Manufacturer
Regulus is a contract manufacturer based in Taiwan. We provide PCBA and box-build services for industrial & consumer electronics and medical devices. You come to us with a design and we make it into a reality.
Industry Directory | Manufacturer
At C I Network Technologies, we are capable of supporting our customers in development of products. Quick turn PCB assembly shortens the product development cycle and requires efficiency and precision.
Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
Industry Directory | Consultant / Service Provider / Manufacturer
WinTronics is a full service, ISO 9001:2000 certified, electronics and electro-mechanical contract manufacturer supporting customers in the commercial, industrial, automotive, Home Land Security, and military markets.
Technical Library | 2018-08-22 14:05:42.0
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.
Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
Technical Library | 2013-03-21 21:24:49.0
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings
Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment