Used SMT Equipment | Pick and Place/Feeders
Equipment name: Fuji XP142E Fuji XP142 parameters Machine year: 2003-2004 Mounting range: 0603-20x20mm (28pin IC), parts below 6mm in height, BGA can be attached 2. Mounting speed: 0.165s/chip, 21800chips/h Mounting accuracy: ±0.05mm App
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
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BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed :18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
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Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m