Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high
Used SMT Equipment | Pick and Place/Feeders
Board size L460*W335(MAX)-L50*W50(MIN) Mounting Accuracy Absolute Accuracy (μ+3σ ±0.05mm/chip, ±0.05mm/QFP Mounting speed 16200CPH Mountable Components 0603-31mm SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA Air 5 K
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Industry News | 2019-03-14 11:28:14.0
Precision PCB Services, Inc. Opens New Texas Location
Used SMT Equipment | Pick and Place/Feeders
parameter: 1. Mounting head: 3 2. Alignment method: linear laser, video system (fixed camera) 3. Substrate size: Min:50*50*0.5(mm)-Max:460*400*4.0(mm), adjustable: 0.28-4.2t 4. Mounting speed: CHIP/ 0.22 seconds/CH
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Chipshooters / Chip Mounters
1 High-speed mounting capacity handling 25, 000CPH(0.14sec/CHIP Equivalent: Optimum condition) +/-50μ M(CHIP), +/-30μ M(QFP)mounting absolute accuracy in full time operation 2 Handles a wide range of components from 0402 chips to W45xL100mm or less
A demo of the Shuttle Star SV560 A BGA Rework Station.
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